Micro Ball Mount Total Process in Wafer-Level and Panel-Level in Chip Preparation for Next on Large Panel-Level Package

The packaging purpose of semiconductor is in order to protect chip and transfer electronic single. In packaging fan-out process, the size are 8 inch, 12 inch wafer and 300×300mm panel, more to achieve the 700×700mm panel which is as the large-size. They are produced with the more hardly and challenge in the process. There are the copper pillar to connect chip and redistribution layer. The worse, it has the more expensive with copper plating process, it is reached the higher cost disbursement. In the paper, a solution is in instead of metal micro ball and mount process to work in chip preparation. 12 inch wafer with copper under ball metal pad, the metal ball mount onto it and post reflow to reform it. Successively, back-end-initial is the wafer thinning and saw to chip size. Secondly, it is worked for die-bond on the 600×600 mm large panel. Thirdly, molding process is filled out top-die side. Finally, grinding with horizontal cutting to reduce the molding thickness to expose the metal ball side are. It is called the metal ball pillar-like process is effectively good in production benefit and use for reducing the process routing.