Numerical and Experimental Investigations on Thermo-Stable Reliability of a Physical Property-Controlled Type High-Heat Dissipation Spacer for Double-Side Cooling Power Modules

This study was carried out to investigate the thermo-stable reliability of a physical property-controlled type high-heat dissipation spacer for double side cooling high power density power modules. KOSTECSYS's proprietary high-heat spacer, which is free of Cu/Mo/Cu interfacial defects or secondary structures due to bonding processes, features a significant heat transfer performance of approximately 280 W/mK along with an extremely controlled coefficient of thermal expansion (CTE). Furthermore, the maximum void size was only below 1 ¼m, which did not significantly affect the thermal conductivity. Even after high-temperature aging at 250 °C, the void size did not grow, and a consistent thermal conductivity trend was maintained. The potential and utility of the high heat dissipation spacer for double-sided cooling power modules developed in this study are further discussed.