Large-Area Bonding for Direct Cooling for Applications in Power Inverters

We introduce an easy way to mass-produce direct cooling for power modules using a facial laser source, a novel designed heat sink, and a low-temperature solder. The serpentine shape heat sink was successfully combined using the laser soldering processes within 30 s to the back surface of direct bonded copper (DBC), forming inter metallic compounds (IMCs) within 1 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{\mu}\mathbf{m}$</tex>. Furthermore, this direct cooling manufacturing method can suppress the void percentage by 3.18%. The novel bonding design and process of heat sinks can minimize thermal deformation at the bonding interface of power modules due to instantaneous heat input.