Silver-Based Metal-Organic Decomposition with 3D Inkjet Printing for Selective Package-Level EMI Shielding

EMI Shielding utilizing Metal-organic Decomposition (MOD) as alternative solution with significant lower energy consumption was studied. The package-level shielding effectiveness (SE) can meet> 30dB in 1 GHz ~ 3.6 GHz and film adhesion quality can meet tape test > 4B as fabricated and after reliability test. Good readability of laser marking texture and 2D barcode could be also obtained under moderate MOD coating.

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Published
2025-04-15
DOI
https://doi.org/10.23919/icep-iaac64884.2025.11002971
Primary Topic
Recycling and Waste Management Techniques
Type
article
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article

Silver-Based Metal-Organic Decomposition with 3D Inkjet Printing for Selective Package-Level EMI Shielding

M. H. Chen, Yung-I Yeh, Ricky Kao, Weihua Wang
Recycling and Waste Management Techniques
article

Silver-Based Metal-Organic Decomposition with 3D Inkjet Printing for Selective Package-Level EMI Shielding

M. H. Chen, Yung-I Yeh, Ricky Kao, Weihua Wang
article en

Abstract

EMI Shielding utilizing Metal-organic Decomposition (MOD) as alternative solution with significant lower energy consumption was studied. The package-level shielding effectiveness (SE) can meet> 30dB in 1 GHz ~ 3.6 GHz and film adhesion quality can meet tape test > 4B as fabricated and after reliability test. Good readability of laser marking texture and 2D barcode could be also obtained under moderate MOD coating.

Advanced Semiconductor Engineering (Taiwan) (TW)
Openalex Percentile: Top 86%
Recycling and Waste Management Techniques
DOISourceOpenAlex
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Silver-Based Metal-Organic Decomposition with 3D Inkjet Printing for Selective Package-Level EMI Shielding — M. H. Chen, Yung-I Yeh, et al. · (2025) | TGRS Research Map | TGRS