Evaluation of the Oxidation Resistance of Cross-Linked Gelatin-Coated Copper Particles

Copper nanoparticles have emerged as a promising alternative to silver in conductive and joining inks or pastes for printed electronics or sintering joining materials due to their lower cost and resistance to ion migration. This study investigates the synthesis and oxidation resistance of gelatin-stabilized copper nanoparticles with various cross-linking treatments. Copper nanoparticles were synthesized using a chemical reduction method, resulting in spherical particles with an average size of 120 nm. The particles underwent one-stage and two-stage cross-linking processes using. Oxidation resistance was evaluated under different temperature and humidity conditions using X-ray diffraction (XRD) and scanning electron microscopy (SEM). The study demonstrates that two-stage cross-linking effectively enhances oxidation resistance in low moisture environments, contributing to the development of more stable copper nanoparticles for electronics parts.