Development of Acid Copper Plating Chemicals for Advanced Packaging with TSV and TGV

In IC packaging, penetrated electrode such as TSV and TGV have been used to improve performance through various packaging structures. These structures are fabricated by forming hole called via, followed by copper filling through plating. In copper plating process, chemicals are necessary to control copper deposition because TSV sand TGV s have high aspect ratios and are prone to void formation during plating. In this study, we have investigated the electrochemical behavior of these chemicals.