Thermal Transfer Analysis by Phonon Vibrations at Interface Between Filler and Resin in Thermal Interface Material

In the automotive power module shown in Fig. 1, since the thermal interface material (TIM) becomes a bottleneck for heat dissipation, it is necessary to develop a TIM with high thermal conductivity. However, the mechanism analysis of the heat transfer at the interface between filler and resin inside the TIM is not sufficient. This study examines two materials in Table I. In Investigation 1, three-dimensional heat conduction inside the TIM was analyzed to calculate the interfacial heat transfer coefficient. In Investigation 2, heat transfer coefficient due to phonon conduction was calculated by thermal molecular dynamics (MD) method. By comparing these two results, we found a relationship between the bonding state of molecules and the heat transfer at the filler - resin interface.