Efforts to Improve the Accuracy of Simulation Technology for Package Substrates by Acquiring Realistic Material Properties

After 2020, the insertion loss of transmission lines in package substrates using high-speed signal transmission has been focused more with the rapid growth of the high-speed network society [1]. In this paper, actual dimensions, material properties, and surface roughness were used to evaluate the effect of achieving more accurate simulation of high-speed signals on the FC-BGA route. The results show a good correlation between the simulation and measurement up to 60 GHz.