Fine Printing by Gravure Offset Using Low-Temperature Sintered Copper

We developed a low-temperature sintering copper paste suitable for gravure offset printing and attempted to print fine circuits. Copper that can be sintered at low temperatures is expected to open new strategies in the field of printed electronics. We successfully printed copper fine circuits with L/S = 10µm/12µm using the gravure offset printing method, which excels in fine printing.