Investigates of Silver Sintered Process by Silver Thin Films and Nanotwinned Silver Thin Films
Silver material sintering is a highly promising method for die attachment technology in power electronic devices because of its excellent thermal and electrical conductivities, along with its superior mechanical properties. The cross-sectional analyses of the sintering process of nanotwinned Ag (Nt-Ag) thin films indicate minimal porosity at the interface, leading to increased shear strength.
Authors
- P.S. Kao
- Fan-Yi Ouyang (ORCID: https://orcid.org/0000-0001-6767-127X)
- Yuhua Wu (ORCID: https://orcid.org/0000-0003-0526-8228)
- Yancheng Liu (ORCID: https://orcid.org/0000-0002-9169-7856)
- Yung-Min Hsieh
- Shin-Yi Huang
- Tao-Chih Chang
Institutions
- National Tsing Hua University (TW)
- Industrial Technology Research Institute (TW)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11003031
- Primary Topic
- Nanoporous metals and alloys
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Tsing Hua University