Reliability and Warpage of High Density Package Using Organic Interposer for Heterogeneous Integration

TEG chips were assembled on 2.3D i-THOP (integrated-Thin film High density Organic Package) and reliability tests were conducted at the package level. It was confirmed that low CTE UFR (Underfill Resin) is required using organic interposer for heterogeneous integration. For large packages, it is important to optimize the design of a package structure that reduces warpage, in addition to applying an UFR with high flowability.

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Publication Details

Published
2025-04-15
DOI
https://doi.org/10.23919/icep-iaac64884.2025.11002874
Primary Topic
3D IC and TSV technologies
Type
article
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article

Reliability and Warpage of High Density Package Using Organic Interposer for Heterogeneous Integration

Shota Miki, Yoshihiro Kobayashi
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3D IC and TSV technologies
article

Reliability and Warpage of High Density Package Using Organic Interposer for Heterogeneous Integration

Shota Miki, Yoshihiro Kobayashi
article en

Abstract

TEG chips were assembled on 2.3D i-THOP (integrated-Thin film High density Organic Package) and reliability tests were conducted at the package level. It was confirmed that low CTE UFR (Underfill Resin) is required using organic interposer for heterogeneous integration. For large packages, it is important to optimize the design of a package structure that reduces warpage, in addition to applying an UFR with high flowability.

Shinko Electric Industries (Japan) (JP)
Openalex Percentile: Top 91%
3D IC and TSV technologies
DOISourceOpenAlex
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Reliability and Warpage of High Density Package Using Organic Interposer for Heterogeneous Integration — Shota Miki, Yoshihiro Kobayashi · (2025) | TGRS Research Map | TGRS