Driving Efficiency in Advanced Packaging: TGV Tool Concepts and Supply Chain Impacts

Through-Glass Via (TGV) technology plays a crucial role in advanced semiconductor packaging by enabling high-density interconnects for heterogeneous integration. [1] The choice of the laser system for TGV formation significantly affects not only the via creation process but also subsequent process steps, including etching, metallization, and integration. This paper examines the impact of Laser Induced Deep Etching (LIDE) on these dependencies and highlights how an optimized laser process can improve overall efficiency in advanced packaging. LIDE technology allows for the precise formation of TGV s with controlled taper angles while also enabling additional structuring capabilities such as blind vias, cavities, channels, and cutouts. These features, while expanding design flexibility, also introduce constraints for metallization and substrate integration. The feasibility and cost of downstream processes depend on the characteristics of the initial laser structuring. The design process plays a central role in determining the manufacturability and cost-effectiveness of glass-based packaging solutions. If certain constraints are overlooked during the initial design phase, later process steps may become more complex, costly, or even unfeasible. This paper discusses how the interplay between LIDE processing, design decisions, and supply chain constraints affects final package performance and cost.