High-speed Solder Ball Shear Test and Component Shear Test for Evaluating the Robustness of Solder Joints under Different Reflow Profiles

In this paper, high-speed single ball shear (HSSBS) and component shear (CS) test are separately used for studying the effect of assembly peak reflow temperature and pre-condition on package level and board level solder joint robustness. The shear strength and the percentage of fracture mode are collected as indices of solder joint robustness. The result of this study shows that ball-attach (BA) reflow with 260°C peak temperature profile induces lower shear strength and high ratio of brittle mode. High correlation on shear strength is found between HSSBS and CS, and positive correlation on the percentage of brittle fracture mode is observed among HSSBS, CS, and drop test. In conclusion, the shear strength of the solder joint and the corresponding fracture mode are characterized by HSSBS and CS tests.