Next Generation Chiplet Technology Development: Focusing on Fine RDL Patterning
To achieve high performance and low transmission loss in the next generation chiplets, fine-pitched hybrid bonding and fine Redistribution Layer (RDL) formation are key technologies. This paper reports on the established short- Turn-Around- Time (T AT) material development consortium named RCS consortium to screen new, photo or non-photo-sensitive dielectric organic materials by utilizing both front-end technologies, fine Lithography and Damascene Chemical Mechanical Polishing (CMP), and the development of high-performance materials and RDL patterning processes.
Authors
- Keisuke Suzuki (ORCID: https://orcid.org/0000-0001-5790-1289)
- Mitsuru Ozono
- Hiroshi Nishizawa
- Masahiro Yasuda (ORCID: https://orcid.org/0000-0002-8384-8167)
- Masaru Sasago
- Y. Hirai
- Satoshi Takahashi (ORCID: https://orcid.org/0000-0002-1076-2338)
- Y. Minami (ORCID: https://orcid.org/0000-0003-1487-8810)
- S. Yamamoto
- Toshio Doi (ORCID: https://orcid.org/0000-0003-4471-4593)
- Takamitsu Saito
- H. Kimuro
Institutions
- Osaka Prefecture University (JP)
- Kyushu Institute of Technology (JP)
- Osaka Metropolitan University (JP)
- National Institute of Advanced Industrial Science and Technology (JP)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11002972
- Citations
- 1
- Primary Topic
- Digital Rights Management and Security
- Type
- article
- Field-Weighted Citation Impact
- 3.25