A Comprehensive Evaluation of Simulating Thermal Conductivity in Oak Wood Using XCT Imaging

Wood drying is the most critical and energy-intensive process in the wood industry. However, the complex pore structure of wood significantly affects its thermal performance. Therefore, it is essential to study the relationship between the pore structure and the thermal properties of wood. In this study, X-ray-computed tomography (XCT) technology, combined with digital image processing (DIP) techniques, was used to visualize and characterize the three-dimensional structure of oak samples. Parameters such as porosity, pore size and distribution, and fractal dimensions were obtained to investigate their relationship with thermal conductivity. Subsequently, the thermal conductivities of the oak samples in the tangential, radial, and axial directions were simulated based on their three-dimensional structure. The simulation results were validated using the transient plane source method (TPS). The results showed that there were significant differences in porosity and pore size between earlywood and latewood, which in turn affect the correlation between fractal dimension and thermal conductivity. The higher the self-similarity of the wood structure is, the stronger the correlation between porosity and fractal dimension will be. Due to the limitations of CT resolution and threshold segmentation methods, there may be some axial deviations in the heat transfer simulation based on XCT. However, overall, this method provides a relatively accurate estimate of the effective thermal conductivity of oak wood. In addition, the pit structure and the research on heat conduction of wood-based multi-scale pore structures are of crucial importance to the study of heat conduction in wood.