Design and Electro-Thermal Co-Analysis of SIW Filters for SiP
In this paper, the filters, which can be applied to system in package, are studied. An eighth-order Chebyshev filter is proposed to design by using the coupling coefficient method. To improve the out-of-band suppression of the filter, cross-coupling is added to the filter design. Two transmission zeros are introduced on both sides of the passband. The cross-coupling structure is inverted Z-shaped. The position of the transmission zero is modulated by adjusting the length and width of the intermediate short stub. The designed filter is for the 5G millimeter wave band, with the center frequency of 29.25 GHz, the bandwidth of 3.5 GHz, and the rectangular coefficient (45dB/1dB) of 1.4. For continuous wave signal power, the power handling capability of the filter is limited by the self-heating of the planar circuit. Here, the average power handling capability of the designed filter is analyzed by the method of electrothermal hybrid simulation.
Authors
- Shengying Zou
- Yuedong Xu (ORCID: https://orcid.org/0000-0003-4168-3998)
- Chen Chen (ORCID: https://orcid.org/0000-0001-7696-2474)
- Peng Jin (ORCID: https://orcid.org/0000-0003-2228-131X)
- Xuyao Zhang (ORCID: https://orcid.org/0000-0003-4301-0666)
- Jie Lin
Institutions
- Chinese Academy of Sciences (CN)
- Harbin Institute of Technology (CN)
- Suzhou Institute of Nano-tech and Nano-bionics (CN)
Publication Details
- Published
- 2024-11-21
- DOI
- https://doi.org/10.1109/aisomt64170.2024.10992114
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00