3D-IC Chiplet Integrated Power Supply with LDO, SCVR, and Buck DC-DC Converter
With the rapid advancement of chiplet and heterogenous integration technologies, supplying power through package, RDL, and chip layers in three-dimensional space has become a fundamental challenge for high-performance SoCs. This paper presents a comprehensive collection of power supply solutions, including LDOs, switched capacitor, and Buck converters. Advanced techniques, such as novel conversion topologies, control schemes, optimization methods, and integration strategies are detailed and compared to provide insights for overcoming the power wall in emerging 3D-ICs.
Authors
- Xiaosen Liu (ORCID: https://orcid.org/0000-0003-2767-215X)
- Xichen Sun
- Haozhe Zhang (ORCID: https://orcid.org/0000-0001-6363-5271)
- Yan Wang (ORCID: https://orcid.org/0000-0002-7834-7499)
Institutions
- Tsinghua University (CN)
Publication Details
- Published
- 2025-04-13
- DOI
- https://doi.org/10.1109/cicc63670.2025.10982997
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- National Key Research and Development Program of China