Additive Manufactured Embedded Ground Plane Design for 3D Heterogeneous Integration and Packaging of RF Chips

This paper presents a novel, fully additivemanufactured approach to 3D heterogeneous integration and packaging of RF chips. The proposed solution utilizes an embedded ground plane to create RF transitions using transmission lines. This technique assists with the fabrication of multi-layer structures in the future. By integrating 3D-printed ground planes into fully additive manufactured processes, more flexible impedance matching has been shown in the packaging of RF chips. Using this aforementioned method, impedance matching at higher layers has been achieved, allowing for the fabrication of more complex 3D-printed layered circuits.