In Situ MOVPE Smoothing of Acoustically Spalled GaAs for Substrate Reuse

High material costs, especially for substrates, have limited the widespread adoption of III–V photovoltaics. A potential to reduce this cost is to reuse the III–V substrate via acoustic spalling, however this technique can leave a rough surface, hindering subsequent device performance. This research investigates the potential of using metalorganic vapor-phase epitaxy growth as a buffer layer to smooth the surface of acoustically spalled germanium and gallium arsenide (GaAs) substrates for improved III–V photovoltaic cell yield and performance, while retaining the maximum number of reuses of a substrate. Three potential smoothing layers were explored: lightly doped C:GaAs, highly doped Se:GaInP, and lightly doped Se:GaInP. C:GaAs showed the most promise as a smoothing layer, while Se:GaInP tended to conform to the underlying morphology, potentially increasing roughness in some areas. Utilizing 5 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m of C:GaAs as a planarizing buffer increased the average efficiency (without an antireflection coating) from an as-spalled baseline from 2.1% to 4.9% and performing a 5-min <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$30^{\circ }$</tex-math></inline-formula>C 8:1:1 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mathrm{H_{2}SO_{4}:H_{2}O_{2}:H_{2}O}$</tex-math></inline-formula> etch prior to a 5 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m of C:GaAs as a planarizing buffer further increased efficiency to 11.1%.

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Publication Details

Journal
IEEE Journal of Photovoltaics
Published
2025-05-19
DOI
https://doi.org/10.1109/jphotov.2025.3566754
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

In Situ MOVPE Smoothing of Acoustically Spalled GaAs for Substrate Reuse

Pablo Guimerá Coll, Sara Collins, Emily L. Warren, Myles A. Steiner et al.
IEEE Journal of Photovoltaics
Integrated Circuits and Semiconductor Failure Analysis
article

In Situ MOVPE Smoothing of Acoustically Spalled GaAs for Substrate Reuse

Pablo Guimerá Coll, Sara Collins, Emily L. Warren, Myles A. Steiner, Gavin P. Forcade, Theresa E. Saenz, Mariana I. Bertoni, William E. McMahon, Anica N. Neumann, John Goldsmith
article en

Abstract

High material costs, especially for substrates, have limited the widespread adoption of III–V photovoltaics. A potential to reduce this cost is to reuse the III–V substrate via acoustic spalling, however this technique can leave a rough surface, hindering subsequent device performance. This research investigates the potential of using metalorganic vapor-phase epitaxy growth as a buffer layer to smooth the surface of acoustically spalled germanium and gallium arsenide (GaAs) substrates for improved III–V photovoltaic cell yield and performance, while retaining the maximum number of reuses of a substrate. Three potential smoothing layers were explored: lightly doped C:GaAs, highly doped Se:GaInP, and lightly doped Se:GaInP. C:GaAs showed the most promise as a smoothing layer, while Se:GaInP tended to conform to the underlying morphology, potentially increasing roughness in some areas. Utilizing 5 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m of C:GaAs as a planarizing buffer increased the average efficiency (without an antireflection coating) from an as-spalled baseline from 2.1% to 4.9% and performing a 5-min <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$30^{\circ }$</tex-math></inline-formula>C 8:1:1 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mathrm{H_{2}SO_{4}:H_{2}O_{2}:H_{2}O}$</tex-math></inline-formula> etch prior to a 5 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\mu$</tex-math></inline-formula>m of C:GaAs as a planarizing buffer further increased efficiency to 11.1%.

IEEE Journal of PhotovoltaicsVol. 15(4)
National Laboratory of the Rockies (US), Sonic Concepts (United States) (US)
Openalex Percentile: Top 91%
Integrated Circuits and Semiconductor Failure Analysis
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