Solid-state thermal regulation

With the normalization of extreme thermal environments such as high heat flux, thermal shock, and microgravity, the proportion of electronic device failures caused by temperature factors has exceeded 55%.Solid-state thermal regulation, which directly modifies material thermal properties with strong heat flux control capabilities, offers transformative solutions for thermal management challenges.However, thermal carrier phonons, which are a kind of quasiparticles, present an internationally recognized scientific challenge because of their inability to directly couple with external stimuli.Due to the vector characteristics of heat flux: intensity, rate, and direction, solid-state thermal regulation faces three major challenges: unclear pathways for strengthening regulation, poor performance in reversible regulation, and low energy density in reverse regulation.In this letter, we discuss the solid-state thermal regulation at the phonon level to address these three primary challenges, aiming to achieve controllable thermal transport.