Modeling moisture ingress in PV modules with different encapsulant and backsheet materials

Increasing the operating lifetime of photovoltaic (PV) modules is a key factor in further reducing their levelized cost of electricity. Analytical degradation models typically use the external relative humidity (RH) as a stress factor, rather than the moisture concentration inside the module. This study presents a Finite Element Method (FEM) model, built in COMSOL Multiphysics, to simulate the moisture ingress inside a PV module. We explore the effects of different encapsulant and backsheet materials, as well as various climatic conditions, on moisture penetration. Overall, the impact of the climate has a larger impact on the moisture ingress than the choice of material, implying that the PV module design should be adjusted for different climates. As FEM simulations are computationally intensive, we also present an analytical model, based on empirically determined characteristics, to simulate the moisture ingress. This reconstruction can be done with a deviation lower than 0.05 for all conditions. Finally, our findings indicate that the relative moisture content (RMC) within the module serves as a more accurate stress factor than outdoor RH. Degradation rates over time found in literature are captured more accurately when deploying RMC. • Development of a numerical model to simulate the moisture ingress in PV modules. • Analysis of the effect of material and climate on moisture ingress. • Development of a new analytical model to reconstruct the moisture ingress results. • The moisture concentration is a better stress factor than the relative humidity.

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Publication Details

Journal
Renewable Energy
Published
2025-05-17
DOI
https://doi.org/10.1016/j.renene.2025.123347
Citations
4
Primary Topic
Photovoltaic System Optimization Techniques
Type
article
Field-Weighted Citation Impact
1.45
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article

Modeling moisture ingress in PV modules with different encapsulant and backsheet materials

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Renewable Energy
Photovoltaic System Optimization Techniques
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article

Modeling moisture ingress in PV modules with different encapsulant and backsheet materials

Youri Blom, Olindo Isabella, Malte Ruben Vogt, Ismail Kaaya, Nikoleta Kyranaki, Rudi Santbergen, Daniel Jimenez Pelarda, Tabitha Minett
article en
4 citations

Abstract

Increasing the operating lifetime of photovoltaic (PV) modules is a key factor in further reducing their levelized cost of electricity. Analytical degradation models typically use the external relative humidity (RH) as a stress factor, rather than the moisture concentration inside the module. This study presents a Finite Element Method (FEM) model, built in COMSOL Multiphysics, to simulate the moisture ingress inside a PV module. We explore the effects of different encapsulant and backsheet materials, as well as various climatic conditions, on moisture penetration. Overall, the impact of the climate has a larger impact on the moisture ingress than the choice of material, implying that the PV module design should be adjusted for different climates. As FEM simulations are computationally intensive, we also present an analytical model, based on empirically determined characteristics, to simulate the moisture ingress. This reconstruction can be done with a deviation lower than 0.05 for all conditions. Finally, our findings indicate that the relative moisture content (RMC) within the module serves as a more accurate stress factor than outdoor RH. Degradation rates over time found in literature are captured more accurately when deploying RMC. • Development of a numerical model to simulate the moisture ingress in PV modules. • Analysis of the effect of material and climate on moisture ingress. • Development of a new analytical model to reconstruct the moisture ingress results. • The moisture concentration is a better stress factor than the relative humidity.

Renewable EnergyVol. 252
Imec the Netherlands (NL), Hasselt University (BE), Delft University of Technology (NL)
Openalex Percentile: Top 19%
Photovoltaic System Optimization Techniques
1.45
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