A Comparison between WIPD and PCB Flip-Chip Packaging for Broadband MFCW Agile Radar in Vital-Sign Detection Applications

Previous work, MFCW Radar for vital sign detection, has been done in our lab. The receiver front-end and the signal source are manufactured using a 180-nm CMOS process, packaged on RO4003C printed-circuit board(PCB) through wire bonding. However, the package carrier and the bonding wire degrade the performance of the radar above 20 GHz. To improve the radar performance, the package method, flip-chip, was implemented to reduce pass losses. At the same time, we compare two different package carriers, the traditional RO4003C printed-circuit board (PCB) and the WIN Integrated Passive Device (WIPD). The WIPD demonstrates superior design flexibility. The measurements showed that using WIPD with flip-chip packaging by the gold bump achieved conversion gains comparable to direct on-wafer measurement.