Study on the thermal performance of three-dimensional oscillating heat pipe with super-hydrophobic/super-hydrophilic surface for thermal management application

The current trend of miniaturization and integration of power chips poses significant challenges to existing thermal management systems, and traditional cooling methods are not capable of meeting their heat dissipation needs. To enhance the heat dissipation efficiency of chip thermal management systems, a novel three-dimensional oscillating heat pipe (3D-OHP) with a flat structure at the bottom of the evaporation section was designed, which facilitates better contact with the heat source. Additionally, to further enhance the operational performance of the 3D-OHP, this work use chemical etching and self-assembly methods to alter the wettability of the internal surface of the 3D-OHP, examining its start-up and heat transfer performance under both vertical and horizontal installation conditions. The results indicate that regardless of vertical or horizontal installation, the 3D-OHP with super-hydrophilic/super-hydrophobic combination surfaces exhibit the best start-up and heat transfer performance. The start-up temperatures of the 3D-OHP are reduced by 22.29 % and 13.50 %, and the thermal conductivities are improved by 15.33 % and 62.45 % compared to the untreated 3D-OHP. Additionally, under the same heating power and wettability conditions, its performance in vertical installation is superior to that in horizontal installation, indicating that this heat pipe is more suitable for vertical installation. The above research provides valuable insights for scholars seeking to enhance the operational performance of 3D-OHPs by altering the wettability of the inner surface, thereby improving the heat dissipation efficiency of power chip thermal management systems. • 3D-OHP operating performance was studied for two installation conditions. • The effect of super-hydrophilic/super-hydrophobicity on 3D-OHP was studied. • The 3D-OHP performance under vertical installation was optimal. • Combination of super-hydrophilic/super-hydrophobic 3D-OHP performed best.

Authors

Publication Details

Journal
International Journal of Thermal Sciences
Published
2025-05-16
DOI
https://doi.org/10.1016/j.ijthermalsci.2025.110007
Citations
6
Primary Topic
Heat Transfer and Boiling Studies
Type
article
Field-Weighted Citation Impact
4.28

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Study on the thermal performance of three-dimensional oscillating heat pipe with super-hydrophobic/super-hydrophilic surface for thermal management application

Kaibao Liu, Changhui Liu, Yikai Wen, HE Wen-hua et al.
6 citations
International Journal of Thermal Sciences
Heat Transfer and Boiling Studies
4.28
article

Study on the thermal performance of three-dimensional oscillating heat pipe with super-hydrophobic/super-hydrophilic surface for thermal management application

Kaibao Liu, Changhui Liu, Yikai Wen, HE Wen-hua, Zeyu Xu, Haolin Gan, Jiateng Zhao
article en
6 citations

Abstract

The current trend of miniaturization and integration of power chips poses significant challenges to existing thermal management systems, and traditional cooling methods are not capable of meeting their heat dissipation needs. To enhance the heat dissipation efficiency of chip thermal management systems, a novel three-dimensional oscillating heat pipe (3D-OHP) with a flat structure at the bottom of the evaporation section was designed, which facilitates better contact with the heat source. Additionally, to further enhance the operational performance of the 3D-OHP, this work use chemical etching and self-assembly methods to alter the wettability of the internal surface of the 3D-OHP, examining its start-up and heat transfer performance under both vertical and horizontal installation conditions. The results indicate that regardless of vertical or horizontal installation, the 3D-OHP with super-hydrophilic/super-hydrophobic combination surfaces exhibit the best start-up and heat transfer performance. The start-up temperatures of the 3D-OHP are reduced by 22.29 % and 13.50 %, and the thermal conductivities are improved by 15.33 % and 62.45 % compared to the untreated 3D-OHP. Additionally, under the same heating power and wettability conditions, its performance in vertical installation is superior to that in horizontal installation, indicating that this heat pipe is more suitable for vertical installation. The above research provides valuable insights for scholars seeking to enhance the operational performance of 3D-OHPs by altering the wettability of the inner surface, thereby improving the heat dissipation efficiency of power chip thermal management systems. • 3D-OHP operating performance was studied for two installation conditions. • The effect of super-hydrophilic/super-hydrophobicity on 3D-OHP was studied. • The 3D-OHP performance under vertical installation was optimal. • Combination of super-hydrophilic/super-hydrophobic 3D-OHP performed best.

International Journal of Thermal SciencesVol. 215
Fundamental Research Funds for the Central Universities
Openalex Percentile: Top 6%
Heat Transfer and Boiling Studies
4.28
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.