Influence of electrode spacing on the electrochemical migration failure characteristics

With the miniaturization of microelectronic devices, electrochemical migration (ECM) has become a major failure mechanism in high-density packaging. In this study, a multi-field coupling simulation model of interdigitated electrode ECM was constructed based on the finite element analysis method, and the influence of electrode spacing on ECM was studied systematically. It was found that when the spacing was reduced from 20 μm to 3 μm, the ionic diffusion flux between electrodes increased by 2.5 times, and the maximum diffusion flux increased exponentially. The results reveal the quantitative correlation between the low-pitch electrode structure and the failure mechanism of ECM, which provides theoretical guidance for the reliability design of electrode structure in high-density electronic packaging, and has important significance for improving the reliability of microelectronic devices in the fields of 5G communication and wearable devices.