A Comprehensive Reliability Approach to Heterogeneous Integration in Power Packaging (Invited)

Heterogeneous integration is the combination of different types of components, separately manufactured, into a higher-level assembly, known as System-in-Package (SiP). It represents a high-performing alternative to System on Chip (SoC) and a competitive solution for several market segments. This paper presents SiP scope and needs for power applications. The reliability challenges imposed by the interaction among different materials and interconnection technologies are discussed, in the perspective of a comprehensive approach to SiP lifetime characterization.