Ordered Substrate Routing for High-Density Packaging Combining Improved Astar Algorithm

The substrate routing in high-density packaging boards is the physical connection foundation for various components. Optimizing substrate routing methods and technologies significantly enhances the performance and reliability of chips. Previous works have proposed numerous substrate routing algorithms. However, due to the discrepancies between actual routing results and expectations, manual adjustments are frequently necessary, coupled with prolonged routing times, which extend the design cycle. Therefore, in this paper, we propose a high-density packaging substrate routing algorithm based on ordered detailed routing. By pre-routing grouping of interconnections and order planning, as well as optimizing the Astar search algorithm, this paper aims to enhance overall routing capability and accelerate routing speed. The experimental results show that compared to Wen's routing algorithm, the proposed routing algorithm reduces the average wirelength by 1.1 % and routing time by 13.7% while maintaining the routability.