Impact of Bi-Layer Gate Stack and Thickness on Low Frequency TDDB in FinFET and Planar Devices

AC TDDB (Time-Dependent-Dielectric-Breakdown) lifetime exhibits inconsistency at low frequencies (<10kHz), while it is reported to be longer at higher frequencies. In this study, AC TDDB mechanism is systematically investigated over a frequency range of 2Hz to 500kHz. Notably, n-type transistors with bi-layer gate stack demonstrate degradation of AC TDDB lifetime below that of DC TDDB in both FinFET and Planar devices. This degradation worsens as the gate oxide thickness decreases, a phenomenon explained by Maxwell-Wagner instability. To mitigate this degradation at low frequencies (LF), applying a small positive voltage during the off-state of the AC pulse (Vr) can improve reliability, particularly in circuits operating at low frequencies.

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Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10982768
Primary Topic
3D IC and TSV technologies
Type
article
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article

Impact of Bi-Layer Gate Stack and Thickness on Low Frequency TDDB in FinFET and Planar Devices

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1 links
3D IC and TSV technologies
article

Impact of Bi-Layer Gate Stack and Thickness on Low Frequency TDDB in FinFET and Planar Devices

J. Kim, Kartika Chandra Sahoo, Rakesh Ranjan, Pavitra Ramadevi Perepa, D. Dau, Ki‐Don Lee, M.K. Jung, Robert E. Moeller, John A. Frerich
article en

Abstract

AC TDDB (Time-Dependent-Dielectric-Breakdown) lifetime exhibits inconsistency at low frequencies (<10kHz), while it is reported to be longer at higher frequencies. In this study, AC TDDB mechanism is systematically investigated over a frequency range of 2Hz to 500kHz. Notably, n-type transistors with bi-layer gate stack demonstrate degradation of AC TDDB lifetime below that of DC TDDB in both FinFET and Planar devices. This degradation worsens as the gate oxide thickness decreases, a phenomenon explained by Maxwell-Wagner instability. To mitigate this degradation at low frequencies (LF), applying a small positive voltage during the off-state of the AC pulse (Vr) can improve reliability, particularly in circuits operating at low frequencies.

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