Impact of Bi-Layer Gate Stack and Thickness on Low Frequency TDDB in FinFET and Planar Devices
AC TDDB (Time-Dependent-Dielectric-Breakdown) lifetime exhibits inconsistency at low frequencies (<10kHz), while it is reported to be longer at higher frequencies. In this study, AC TDDB mechanism is systematically investigated over a frequency range of 2Hz to 500kHz. Notably, n-type transistors with bi-layer gate stack demonstrate degradation of AC TDDB lifetime below that of DC TDDB in both FinFET and Planar devices. This degradation worsens as the gate oxide thickness decreases, a phenomenon explained by Maxwell-Wagner instability. To mitigate this degradation at low frequencies (LF), applying a small positive voltage during the off-state of the AC pulse (Vr) can improve reliability, particularly in circuits operating at low frequencies.
Authors
- J. Kim
- Kartika Chandra Sahoo
- Rakesh Ranjan (ORCID: https://orcid.org/0000-0002-0089-1734)
- Pavitra Ramadevi Perepa
- D. Dau
- Ki‐Don Lee
- M.K. Jung
- Robert E. Moeller
- John A. Frerich
Institutions
- Samsung (United States) (US)
Publication Details
- Published
- 2025-03-30
- DOI
- https://doi.org/10.1109/irps48204.2025.10982768
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00