Chip Scale Packaging and Its Failure Analysis Challenges (invited)

Chip Scale Packages (CSPs) have the advantage of smaller size and low package profile, lesser weight, relatively easier assembly process, lower overall manufacturing costs and improved electrical performance. However, the CSPs, particularly the ones built in the 2.5D and 3D System in Package (SiP) devices, have created significant challenges for failure analysis. In this paper, an overview of CSPs will be provided. Some failure analysis challenges, including fault isolation precision, non-destructive imaging, and sample preparation, will be discussed. Finally, solutions and best practices will be discussed, and two case studies will be shared on how to overcome some of the challenges.