Using Thermal Reflectance Analysis with the Microsanj for Open Defect Localization

The Microsanj Thermal Reflectance (TR) Imaging method [3] for locating open circuits enables new Failure Analysis (FA) paths for direct examination of defects. This method increases the probability of finding the root cause for open lines in flexible package traces. The method uses X-ray, C-SAM (Scanning Acoustic Microscopy) and Thermal imaging as non-destructive methods to locate open faults. This process was used to conduct electrical tests and destructive analysis to examine a failing flexible ribbon cable. The result thermal imaging data showed the location of an open fault in the cable signal trace without causing any disruptive damage to the sample under evaluation. Later laser exposure was used to remove the insulation material to confirm the location of the open fault in the sample under evaluation by optical imaging and electrical check. This paper demonstrates that Microsanj TR Imaging can provide clear visual results of open faults in metal traces found in flexible ribbon cables and flex circuits down to a resolution of several microns for failure analysis.