Failure Mechanism and Unified Endurance Model of Embedded MRAM Towards Cache Application
Magnetic random-access memory (MRAM) shows great promise as an embedded working memory solution for data-intensive high-performance computing (HPC) and artificial intelligence (AI) applications. It requires not only high speed but also exceptional endurance performance. In this study, we discovered that current impact plays a critical role in bipolar stress (relative high voltage) and decreased while operating (relative low voltage). By integrating existing breakdown physics, a new model incorporating self-heating to estimate endurance is developed. The endurance model is used to identify the optimal operation window for maximal endurance in 1T1R MRAM cell.
Authors
- Chengyu Wu (ORCID: https://orcid.org/0000-0003-1547-3516)
- W. H. Chuang
- A. Wang
- Y. S. Chen (ORCID: https://orcid.org/0000-0003-3841-8114)
- C. Y. Wang
- Kevin Huang (ORCID: https://orcid.org/0000-0003-2718-2214)
- Y. J. Lee
- Yun-Liang Chu (ORCID: https://orcid.org/0000-0003-0121-2008)
- Harry Chuang
- Y. H. Chen
- K. F. Huang
- Y. C. Ong
Institutions
- Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Publication Details
- Published
- 2025-03-30
- DOI
- https://doi.org/10.1109/irps48204.2025.10983785
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00