Demonstrated Reliability of the Ideal Switch® - Glass Based MEMS Device
Menlo Microsystems has introduced a MEMS switch that utilizes both a glass substrate and a glass cap with through glass via (TGV) technology to provide an all-glass packaging solution. The MEMS switch technology, created in the R&D labs at GE, combined with an all-glass packaging solution, has resulted in the Ideal Switch<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup>. It is the world's smallest, most reliable, and efficient micro-mechanical switch that can be used for numerous RF and power applications. The Ideal Switch® gains superior performance as well as mechanical, electrical and thermal reliability from several aspects of the MEMS and glass packaging design including robust electrical contacts, low electrical loss of glass, and hermetic TGVs which provide a well-controlled environment. This controlled environment is crucial for attaining reliable performance over billions of cycles. In addition to long lifetimes, parasitics are reduced by >75% vs. Si based RF devices enabling the devices to have a wide operational bandwidth from DC to > 50 GHz. Here, we will provide an overview of the aspects of Menlo's all glass packaged Ideal Switch® that enables reliable high frequency RF performance for a range of applications.
Authors
- J.E. Brewer
- Gu Yu (ORCID: https://orcid.org/0000-0002-2757-3066)
- Aric Shorey
- C.R. Nassar
Institutions
- Menlo School (US)
Publication Details
- Published
- 2025-03-30
- DOI
- https://doi.org/10.1109/irps48204.2025.10983246
- Citations
- 1
- Primary Topic
- Advanced MEMS and NEMS Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.73