Optimization of Liquid Cooling Double-layer Heatsink for SiC Power Modules

The proposal research aims to modify the new structure of the SiC MOSFET power module double-layer heatsink to perform the most appropriate thermal achievement. Liquid cooling has shown to be a better approach for regulating the heat created by the power module, giving increased thermal performance. This work focuses on the geometrical optimization of liquid cooling double-layer heat sinks using the Pareto front method to reduce thermal resistance and achieve an appropriate cooling coefficient of performance. The results reveal the thermal resistance reduction with the increase of geometrical parameters. With the expansion of wall thickness, pin fin diameter and pin fin height of the heat sink, the thermal resistance is reduced by 22.5 percent. At the same condition, optimization showed a decrease in the cooling coefficient of performance by 287.8 percent.