Reliability Qualification of 1250V Lateral GaN HEMTs for High Reliability Industrial Applications (Invited)

In this work, we present detailed high-voltage reliability qualification results for the industry's first 1250Vrated lateral GaN HEMT with significant transient overvoltage capability making it ideal for high-reliability industrial applications. Based on the PowiGaN™ technology platform of Power Integrations, the 1250V GaN cascode device shows stable off-state leakage beyond 2000V with a typical breakdown voltage of 2300 V. Results from high voltage off-state reliability stresses HTRB and H3TRB along with hard-switching DHTOL stress are discussed in detail, illustrating for the first time that lateral GaN HEMTs can be a realistic wide band-gap solution at this voltage level. Additionally, we have also demonstrated high-efficiency power supply operation at high-input voltages using a 1250V flyback switcher IC, confirming its readiness for real-world use.

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Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10983084
Primary Topic
GaN-based semiconductor devices and materials
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article
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article

Reliability Qualification of 1250V Lateral GaN HEMTs for High Reliability Industrial Applications (Invited)

Sorin Georgescu, Karthick Murukesan, K.R. Varadarajan, Bhawani Shankar et al.
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GaN-based semiconductor devices and materials
article

Reliability Qualification of 1250V Lateral GaN HEMTs for High Reliability Industrial Applications (Invited)

Sorin Georgescu, Karthick Murukesan, K.R. Varadarajan, Bhawani Shankar, A. L. Ankoudinov, Robert Yang, A. Kudymov
article en

Abstract

In this work, we present detailed high-voltage reliability qualification results for the industry's first 1250Vrated lateral GaN HEMT with significant transient overvoltage capability making it ideal for high-reliability industrial applications. Based on the PowiGaN™ technology platform of Power Integrations, the 1250V GaN cascode device shows stable off-state leakage beyond 2000V with a typical breakdown voltage of 2300 V. Results from high voltage off-state reliability stresses HTRB and H3TRB along with hard-switching DHTOL stress are discussed in detail, illustrating for the first time that lateral GaN HEMTs can be a realistic wide band-gap solution at this voltage level. Additionally, we have also demonstrated high-efficiency power supply operation at high-input voltages using a 1250V flyback switcher IC, confirming its readiness for real-world use.

Power Integrations (United States) (US)
Industry, innovation and infrastructure
Openalex Percentile: Top 94%
GaN-based semiconductor devices and materials
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Reliability Qualification of 1250V Lateral GaN HEMTs for High Reliability Industrial Applications (Invited) — Sorin Georgescu, Karthick Murukesan, et al. · (2025) | TGRS Research Map | TGRS