Evidence for 2D Hole Gas in GaN Gate Injection Transistors and its Role in RDs<sub>on</sub> Recovery

We investigate GaN-based gate injection transistors (GITs) with and without an additional AlGaN back-barrier (BB), located between the GaN:uid layer and the buffer. Evidence of the presence of a 2D hole gas (2DHG) in this BB is collected through electroluminescence (EL) measurements: Devices with a BB exhibit EL throughout the active device area, while EL is restricted to the gate area in conventional devices without BB. Experimental observations of a gate-bias accelerated dynamic <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$R_{\text{DSon}}$</tex> recovery in BB devices, after the application of off-state stress, suggest a faster return of the drain current to initial values compared to GITs lacking a BB. The off-state stress recovery measurements are complemented by TCAD simulations, providing insights into the impact of redistribution of charges in the 2DHG. These simulations also suggest how devices without BB distribute injected holes during recovery.

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Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10983056
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Evidence for 2D Hole Gas in GaN Gate Injection Transistors and its Role in RDson Recovery

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Semiconductor materials and devices
article

Evidence for 2D Hole Gas in GaN Gate Injection Transistors and its Role in RDson Recovery

João L. Gomes, M. Stabentheiner, Bernhard Ruch, D. Pogány, Clemens Ostermaier, Boris Butej, Korbinian Reiser, Michael Waltl, Rajarshi Roy Chaudhuri, Christian Koller
article en

Abstract

We investigate GaN-based gate injection transistors (GITs) with and without an additional AlGaN back-barrier (BB), located between the GaN:uid layer and the buffer. Evidence of the presence of a 2D hole gas (2DHG) in this BB is collected through electroluminescence (EL) measurements: Devices with a BB exhibit EL throughout the active device area, while EL is restricted to the gate area in conventional devices without BB. Experimental observations of a gate-bias accelerated dynamic <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$R_{\text{DSon}}$</tex> recovery in BB devices, after the application of off-state stress, suggest a faster return of the drain current to initial values compared to GITs lacking a BB. The off-state stress recovery measurements are complemented by TCAD simulations, providing insights into the impact of redistribution of charges in the 2DHG. These simulations also suggest how devices without BB distribute injected holes during recovery.

Infineon Technologies (Germany) (DE), TU Wien (AT), Christian Doppler Laboratory for Thermoelectricity (AT), Infineon Technologies (Austria) (AT)
Österreichische Nationalstiftung für Forschung, Technologie und Entwicklung
Affordable and clean energy
Openalex Percentile: Top 91%
Semiconductor materials and devices
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