Methodology of Predicting Package Early Failure

Majority investigations linking reliability to yield were focused on device/interconnect defects, but investigations at 2.5D/3D packaging level are quite limited. Herein, product yield and packaging reliability early failure rate (EFR) correlation is addressed. Starting from the same root cause defects, EFR is derived as a function of yield loss over stress time and calibrated by experimental data. A “burn-in” calculator is developed to screen out early failures to achieve fast product time-to-market with high quality.