Temperature and Drift-Aware High-Level PCM-based Array Model for Reliable Hardware IMC Design

In-Memory Computing (IMC) is a promising approach aimed at overcoming the memory wall dilemma. Emerging non-volatile memories, such as Phase-Change Memory (PCM) are fundamental for low-power IMC on the edge. However, PCM device non-idealities, hardware challenges, and application-dependent requirements render the design of IMC particularly complex. In this work, we tackle this challenge by proposing a novel high-level PCM-based model for hardware IMC. For the first time, we consider the temperature effect on PCM conductance stability–a key parameter for reliable PCM-based IMC hardware.

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Publication Details

Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10982734
Citations
3
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
2.19
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Temperature and Drift-Aware High-Level PCM-based Array Model for Reliable Hardware IMC Design

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3 citations
3D IC and TSV technologies
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article

Temperature and Drift-Aware High-Level PCM-based Array Model for Reliable Hardware IMC Design

E. Esmanhotto, Xavier Lecoq, Lorena Anghel, Mario Allegra, M. Baldo, Guillaume Prenat, V. Viollet
article en
3 citations

Abstract

In-Memory Computing (IMC) is a promising approach aimed at overcoming the memory wall dilemma. Emerging non-volatile memories, such as Phase-Change Memory (PCM) are fundamental for low-power IMC on the edge. However, PCM device non-idealities, hardware challenges, and application-dependent requirements render the design of IMC particularly complex. In this work, we tackle this challenge by proposing a novel high-level PCM-based model for hardware IMC. For the first time, we consider the temperature effect on PCM conductance stability–a key parameter for reliable PCM-based IMC hardware.

Institut polytechnique de Grenoble (FR), Centre National de la Recherche Scientifique (FR), Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR), CEA Grenoble (FR), STMicroelectronics (France) (FR), Spintronique et Technologie des Composants (FR), STMicroelectronics (Italy) (IT), Université Grenoble Alpes (FR)
Affordable and clean energy
Openalex Percentile: Top 12%
3D IC and TSV technologies
2.19
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