Crack Catcher AI — Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages
The importance of silicon cannot be undermined - in photovoltaics (PV) as well as in semiconductor industries. However, silicon is very brittle. Silicon cells/wafers crack easily during manufacturing assembly and/or during device operations. Crack Catcher AI uses novel smart fracture mechanics approach with Artificial Intelligence (AI) methodologies to predict and control crack/damage evolution in thin silicon cells/wafers. This is critical as semiconductor 3D integration technology calls for wafer-to-wafer bonding with utmost alignment accuracy and yield/reliability.
Authors
- Kuncahyo Setyo Nugroho (ORCID: https://orcid.org/0000-0001-7716-0246)
- M. Henry (ORCID: https://orcid.org/0000-0002-0608-9339)
- Dianing Novita Nurmala Putri (ORCID: https://orcid.org/0009-0006-6380-4948)
- Andrea Stevens Karnyoto (ORCID: https://orcid.org/0000-0001-8266-2072)
- Gary Preston (ORCID: https://orcid.org/0000-0003-1864-4077)
- Henry Candra (ORCID: https://orcid.org/0000-0002-0746-8795)
- Tyas Kartika Sari (ORCID: https://orcid.org/0000-0003-0428-2255)
- Arief Suriadi Budiman (ORCID: https://orcid.org/0000-0003-0684-4426)
- Bens Pardamean (ORCID: https://orcid.org/0000-0002-7404-9005)
- Derrick Speaks (ORCID: https://orcid.org/0000-0003-3540-1720)
- Endang Djuana (ORCID: https://orcid.org/0000-0002-2530-521X)
- Muhamad Doris (ORCID: https://orcid.org/0000-0002-8380-3508)
- Mahmud Isnan (ORCID: https://orcid.org/0000-0002-5519-0521)
- Greer Gonzolez
- Fitya Syarifa Mozar
Institutions
- Oregon Institute of Technology (US)
- Universitas Trisakti (ID)
- Binus University (ID)
Publication Details
- Published
- 2025-03-30
- DOI
- https://doi.org/10.1109/irps48204.2025.10983660
- Citations
- 1
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.67