Distinct Signatures of Self-Heating and Trap Dynamics on the AC Y-Parameters of Advanced n-MOSFETs

This paper explores the frequency dispersion of Y-parameters in advanced FDSOI MOSFETs and FinFETs, focusing on the primary causes of output conductance dispersion across varying gate voltages. Through a combination of experimental measurements and numerical simulations using physical TCAD, we identify distinct patterns that differentiate the effects of self-heating (SH) and trapping-detrapping (TD) mechanisms on device capacitances and conductances. By determining the conditions under which SH effects dominate over TD ones, and vice versa, our analysis provides valuable insights for technology optimization, circuit design, thermal resistance extraction using the AC output conductance method, estimation of the device temperature and more accurate device lifetime predictions under self-heating stress conditions.

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Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10983442
Citations
1
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
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article
Field-Weighted Citation Impact
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article

Distinct Signatures of Self-Heating and Trap Dynamics on the AC Y-Parameters of Advanced n-MOSFETs

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Advancements in Semiconductor Devices and Circuit Design
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article

Distinct Signatures of Self-Heating and Trap Dynamics on the AC Y-Parameters of Advanced n-MOSFETs

R. Asanovski, L. Selmi, A.J. Scholten, Ralf Pijper, Thanh Vinh Dinh, Lisa Tondelli, J. Van Beurden
article en
1 citations

Abstract

This paper explores the frequency dispersion of Y-parameters in advanced FDSOI MOSFETs and FinFETs, focusing on the primary causes of output conductance dispersion across varying gate voltages. Through a combination of experimental measurements and numerical simulations using physical TCAD, we identify distinct patterns that differentiate the effects of self-heating (SH) and trapping-detrapping (TD) mechanisms on device capacitances and conductances. By determining the conditions under which SH effects dominate over TD ones, and vice versa, our analysis provides valuable insights for technology optimization, circuit design, thermal resistance extraction using the AC output conductance method, estimation of the device temperature and more accurate device lifetime predictions under self-heating stress conditions.

NXP (Netherlands) (NL), University of Modena and Reggio Emilia (IT), Ferrari (Italy) (IT)
Affordable and clean energy
Openalex Percentile: Top 28%
Advancements in Semiconductor Devices and Circuit Design
0.73
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