Enhanced Dye and Pull Analysis for CSP Package Types

In this paper, we successfully demonstrate the feasibility of performing Dye and Pull Analysis on Chip Scale Package (CSP) types, for which the lab previously experienced structural failure during the pulling process repeatedly which greatly limited the useful information obtained.

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Published
2025-03-30
DOI
https://doi.org/10.1109/irps48204.2025.10983628
Primary Topic
Advancements in Photolithography Techniques
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article
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article

Enhanced Dye and Pull Analysis for CSP Package Types

Daniel J. Sullivan, Sinai Galvan
Advancements in Photolithography Techniques
article

Enhanced Dye and Pull Analysis for CSP Package Types

Daniel J. Sullivan, Sinai Galvan
article en

Abstract

In this paper, we successfully demonstrate the feasibility of performing Dye and Pull Analysis on Chip Scale Package (CSP) types, for which the lab previously experienced structural failure during the pulling process repeatedly which greatly limited the useful information obtained.

Evans Analytical Group (United States) (US), Eurofins (United States) (US)
Openalex Percentile: Top 91%
Advancements in Photolithography Techniques
DOISourceOpenAlex
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Enhanced Dye and Pull Analysis for CSP Package Types — Daniel J. Sullivan, Sinai Galvan · (2025) | TGRS Research Map | TGRS