Influence of deposition power of PECVD intrinsic a-Si:H buffer layer on n+ poly-Si/SiO /c-Si passivating contacts

Optimizing the deposition parameters in the fabrication of passivating contacts for crystalline silicon solar cells is critical for improving efficiency. This study explored the influence of varying RF power of Plasma-Enhanced Chemical Vapor Deposition (PECVD) on the quality of hydrogenated intrinsic amorphous silicon (<i> a-Si:H) films. The aim is to manufacture in-situ phosphorous-doped poly-Si/SiO x /c-Si passivating contacts with <i> a-Si:H as buffer layer between the tunnelling oxide and the n-type poly-Si. The microstructure factor of our intrinsic layers increases from 0.176 to 0.804, that is from higher to lower film density, as the RF power increases from 5 W to 55 W. Analysis using X-ray Photoelectron Spectroscopy and Optical Microscopy indicates that the Si content in SiO x is correlated with the formation of pinholes. Our detailed analysis showed that varying the RF power when depositing <i> a-Si:H contacting layer is crucial in altering both the Si 4+ content in SiO x and the pinhole density, due to the interplay between the plasma etching and the buffering effects during of the <i> a-Si:H layer growth. Notably, the sample processed with 25 W exhibited the maximum pinhole density, the lowest Si 4+ content in SiO x and the deepest phosphorus in-diffusion, potentially yielding superior results in passivation quality and contact resistivity under optimized PECVD conditions. • Investigated the influence of PECVD intrinsic a-Si:H deposition power on n + poly-Si/SiOx/c-Si passivating contacts. • Revealed that increased RF power enhances plasma etching and modifies SiOx stoichiometry and Si 4+ content. • Clarified pinhole density evaluation methods and improved XPS data calibration with C1s correction. • Demonstrated that hydrogen plasma effects dominate passivation improvements compared to LPCVD references. • Insights contribute to the development of high-performance poly-SiOx passivating contacts for TOPCon solar cells.

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Publication Details

Journal
Solar Energy Materials and Solar Cells
Published
2025-05-15
DOI
https://doi.org/10.1016/j.solmat.2025.113709
Citations
1
Primary Topic
Silicon and Solar Cell Technologies
Type
article
Field-Weighted Citation Impact
0.73
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article

Influence of deposition power of PECVD intrinsic a-Si:H buffer layer on n+ poly-Si/SiO /c-Si passivating contacts

Zhirong Yao, Prasad Gonugunta, Guangtao Yang, Paul Prócel et al.
1 citations
Solar Energy Materials and Solar Cells
Silicon and Solar Cell Technologies
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article

Influence of deposition power of PECVD intrinsic a-Si:H buffer layer on n+ poly-Si/SiO /c-Si passivating contacts

Zhirong Yao, Prasad Gonugunta, Guangtao Yang, Paul Prócel, Yingwen Zhao, Wei Si, Prasaanth Ravi Anusuyadevi, Peyman Taheri, Olindo Isabella, Engin Özkol
article en
1 citations

Abstract

Optimizing the deposition parameters in the fabrication of passivating contacts for crystalline silicon solar cells is critical for improving efficiency. This study explored the influence of varying RF power of Plasma-Enhanced Chemical Vapor Deposition (PECVD) on the quality of hydrogenated intrinsic amorphous silicon (<i> a-Si:H) films. The aim is to manufacture in-situ phosphorous-doped poly-Si/SiO x /c-Si passivating contacts with <i> a-Si:H as buffer layer between the tunnelling oxide and the n-type poly-Si. The microstructure factor of our intrinsic layers increases from 0.176 to 0.804, that is from higher to lower film density, as the RF power increases from 5 W to 55 W. Analysis using X-ray Photoelectron Spectroscopy and Optical Microscopy indicates that the Si content in SiO x is correlated with the formation of pinholes. Our detailed analysis showed that varying the RF power when depositing <i> a-Si:H contacting layer is crucial in altering both the Si 4+ content in SiO x and the pinhole density, due to the interplay between the plasma etching and the buffering effects during of the <i> a-Si:H layer growth. Notably, the sample processed with 25 W exhibited the maximum pinhole density, the lowest Si 4+ content in SiO x and the deepest phosphorus in-diffusion, potentially yielding superior results in passivation quality and contact resistivity under optimized PECVD conditions. • Investigated the influence of PECVD intrinsic a-Si:H deposition power on n + poly-Si/SiOx/c-Si passivating contacts. • Revealed that increased RF power enhances plasma etching and modifies SiOx stoichiometry and Si 4+ content. • Clarified pinhole density evaluation methods and improved XPS data calibration with C1s correction. • Demonstrated that hydrogen plasma effects dominate passivation improvements compared to LPCVD references. • Insights contribute to the development of high-performance poly-SiOx passivating contacts for TOPCon solar cells.

Solar Energy Materials and Solar CellsVol. 290
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Silicon and Solar Cell Technologies
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