First-Principles Study of Oxygen Vacancy Defects in Amorphous HfO<sub>2</sub>/Si Interfaces

Understanding the impact of oxygen vacancy defects on the amorphous HfO2/Si interfaces is crucial for improving the performance of Si-based devices. In this study, we combine first-principles calculations with molecular dynamics simulations to investigate the electronic structure, defect states, and carrier transport properties of the amorphous HfO2/Si interfaces. The constructed amorphous HfO2/Si interface is an indirect-gap semiconductor, with the conduction and valence band edges primarily contributed by the Si side. The introduction of oxygen vacancies affects both the size and the nature of the band gap. Specifically, the VO2 defect reduces the band gap by 0.128 eV, while the VO3 defect induces a transition from an indirect to a direct band gap. Hydrogen passivation effectively eliminates defect states, reduces the band gap, and restores the energy band alignment to that of the perfect interface. At low defect concentrations (<1 × 1020 cm–3), the mobility remains stable, exhibiting typical band-like transport characteristics. However, at high defect concentrations, defect-induced lattice distortions and stress concentrations further exacerbate polar optical phonon scattering, leading to a sharp decline in mobility. These findings emphasize the key role of oxygen vacancy defect engineering and passivation in optimizing interface properties, providing theoretical guidance for the design of high-performance Si-based MOS devices.

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Publication Details

Journal
The Journal of Physical Chemistry C
Published
2025-05-14
DOI
https://doi.org/10.1021/acs.jpcc.5c01279
Citations
4
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
2.92

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article

First-Principles Study of Oxygen Vacancy Defects in Amorphous HfO2/Si Interfaces

Ruogu Zheng, Qingbo Wang, Hongxia Zhong, Zhaofu Zhang et al.
4 citations
The Journal of Physical Chemistry C
Semiconductor materials and devices
2.92
article

First-Principles Study of Oxygen Vacancy Defects in Amorphous HfO2/Si Interfaces

Ruogu Zheng, Qingbo Wang, Hongxia Zhong, Zhaofu Zhang, Lei Jin, Lijuan Wang, Hai Wang, Zhengyu Xu, Muti Feng, Bo Xiang
article en
4 citations

Abstract

Understanding the impact of oxygen vacancy defects on the amorphous HfO2/Si interfaces is crucial for improving the performance of Si-based devices. In this study, we combine first-principles calculations with molecular dynamics simulations to investigate the electronic structure, defect states, and carrier transport properties of the amorphous HfO2/Si interfaces. The constructed amorphous HfO2/Si interface is an indirect-gap semiconductor, with the conduction and valence band edges primarily contributed by the Si side. The introduction of oxygen vacancies affects both the size and the nature of the band gap. Specifically, the VO2 defect reduces the band gap by 0.128 eV, while the VO3 defect induces a transition from an indirect to a direct band gap. Hydrogen passivation effectively eliminates defect states, reduces the band gap, and restores the energy band alignment to that of the perfect interface. At low defect concentrations (<1 × 1020 cm–3), the mobility remains stable, exhibiting typical band-like transport characteristics. However, at high defect concentrations, defect-induced lattice distortions and stress concentrations further exacerbate polar optical phonon scattering, leading to a sharp decline in mobility. These findings emphasize the key role of oxygen vacancy defect engineering and passivation in optimizing interface properties, providing theoretical guidance for the design of high-performance Si-based MOS devices.

The Journal of Physical Chemistry CVol. 129(20)
China University of Geosciences (CN), Wuhan University (CN)
National Natural Science Foundation of China, Natural Science Foundation of Guangdong Province, Wuhan University, National Key Research and Development Program of China, Basic and Applied Basic Research Foundation of Guangdong Province
Climate action
Openalex Percentile: Top 9%
Semiconductor materials and devices
2.92
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