Enhancement of a Magnetically Controlled Cathodic Arc Source for the Deposition of Multi-Component Hard Nitride Coatings

The creation of coatings by the cathodic arc evaporation method has outstanding advantages: these coatings are highly durable and wear-resistant, especially since the method has an intense ionization process and the atoms can penetrate deep into the surface substrates, resulting in excellent adhesion. Furthermore, this approach provides precise control over the chemical composition and thickness of the coating, ensuring consistent quality across the entire surface. However, uneven evaporation and ejection of molten metal droplets from the cathode during cathode arc deposition produce particles and droplets, resulting in an uneven coating surface. This study presents a new design for a magnetically controlled cathode arc source to effectively reduce particles and droplets during the cathodic arc deposition of multi-component alloy targets for nitride-based hard coatings. The study compares the performance of a new source with a conventional magnetic-controlled arc source for depositing TiAlNbSiN and AlCrSiN films. In the conventional source, the magnetic field is generated by a permanent magnet (PM), whereas in the new source, it is generated and controlled using an electromagnet (EM). Both films are produced using multi-component alloy targets (TiAlNbSi and AlCrSi) with identical composition ratios. The plasma characteristics of the two different arc sources are investigated using an optical emission spectrometer (OES), and the surface morphology, structural characteristics, deposition rate, uniformity, and surface roughness (Sa) are examined using scanning electron microscopy (SEM). When the EM was applied to have high plasma density, the hardness of the TiAlNbSiN film deposited with the novel arc source measured 31.2 ± 1.9 GPa, which is higher than that of the PM arc source (28.3 ± 1.4 GPa). In contrast, the AlCrSiN film created using a typical arc source exhibited a hardness of only 25.5 ± 0.6 GPa. This lower hardness may be due to insufficient ion kinetic energy to enhance stress blocking and increase hardness, or the presence of the h-AlN phase in the film, which was not detected by XRD. The electromagnet arc source, with its adequate ion bombardment velocity, facilitated a complementary effect between grain growth and stress blocking, leading to a remarkable hardness of 32.6 ± 0.5 GPa.