Robust Transition Metal Contacts for Aligned Carbon Nanotubes

Aligned carbon nanotubes (A-CNTs) are emerging as one of the most promising materials for next-generation nanoelectronics. However, achieving reliable ohmic contacts between A-CNTs and metals remains a critical challenge. In this study, we employ rapid thermal annealing (RTA) to facilitate the formation of transition metal carbides at the metal-CNT interface, significantly reducing contact resistance and enhancing stability. Using the transmission line method (TLM), we demonstrate that RTA reduces the contact resistance at the Ti/A-CNT interface from 112.26 kΩ·μm to 1.57 kΩ·μm and at the Ni/A-CNT interface from 81.72 kΩ·μm to 1.17 kΩ·μm, representing a reduction of over an order of magnitude. Moreover, the Schottky barrier heights (SBHs) for both the Ti/A-CNT and Ni/A-CNT interfaces decreases by approximately 50% after annealing. A comparative analysis with Pd/A-CNT contacts shows that Ti and Ni contacts exhibit superior reliability under harsh conditions. This work provides a viable solution for improving the electrical performance and reliability of CNT-based devices, offering a pathway toward the development of future CMOS technologies.

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Publication Details

Journal
Nanomaterials
Published
2025-05-14
DOI
https://doi.org/10.3390/nano15100736
Citations
1
Primary Topic
Carbon Nanotubes in Composites
Type
article
Field-Weighted Citation Impact
0.52
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article

Robust Transition Metal Contacts for Aligned Carbon Nanotubes

H LIU, Gang Huang, Junhong Wu, Haiou Li
1 citations
Nanomaterials
Carbon Nanotubes in Composites
0.52
article

Robust Transition Metal Contacts for Aligned Carbon Nanotubes

H LIU, Gang Huang, Junhong Wu, Haiou Li
article en
1 citations

Abstract

Aligned carbon nanotubes (A-CNTs) are emerging as one of the most promising materials for next-generation nanoelectronics. However, achieving reliable ohmic contacts between A-CNTs and metals remains a critical challenge. In this study, we employ rapid thermal annealing (RTA) to facilitate the formation of transition metal carbides at the metal-CNT interface, significantly reducing contact resistance and enhancing stability. Using the transmission line method (TLM), we demonstrate that RTA reduces the contact resistance at the Ti/A-CNT interface from 112.26 kΩ·μm to 1.57 kΩ·μm and at the Ni/A-CNT interface from 81.72 kΩ·μm to 1.17 kΩ·μm, representing a reduction of over an order of magnitude. Moreover, the Schottky barrier heights (SBHs) for both the Ti/A-CNT and Ni/A-CNT interfaces decreases by approximately 50% after annealing. A comparative analysis with Pd/A-CNT contacts shows that Ti and Ni contacts exhibit superior reliability under harsh conditions. This work provides a viable solution for improving the electrical performance and reliability of CNT-based devices, offering a pathway toward the development of future CMOS technologies.

NanomaterialsVol. 15(10)
Beijing University of Posts and Telecommunications (CN), Chongqing University (CN), Peking University (CN), Guilin University of Electronic Technology (CN)
Openalex Percentile: Top 39%
Carbon Nanotubes in Composites
0.52
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