Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing

The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (<i>R</i><sup>2</sup> = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.

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Publication Details

Journal
Science Advances
Published
2025-05-14
DOI
https://doi.org/10.1126/sciadv.adv0057
Citations
7
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
4.72
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article

Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing

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Science Advances
Advanced Sensor and Energy Harvesting Materials
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article

Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing

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article en
7 citations

Abstract

The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (<i>R</i><sup>2</sup> = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.

Science AdvancesVol. 11(20)
Electronics and Telecommunications Research Institute (KR), Hanbat National University (KR), Korea Advanced Institute of Science and Technology (KR), Sejong University (KR), Kyungpook National University (KR), University of California, Berkeley (US)
Openalex Percentile: Top 5%
Advanced Sensor and Energy Harvesting Materials
4.72
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