530GHz f<sub>max</sub> 90nm SiGe BiCMOS Technology for Sensing and Communication Applications

This paper reports on Infineon's next generation SiGe BiCMOS technology B12HFC featuring a SiGe HBT with 530GHz maximum oscillation frequency integrated in a 90nm CMOS platform. Electrical high-frequency parameters are shown including uniformity within wafer and lot to lot variation. The features of the process design kit which enables circuit development are described. Results on reliability tests for the new technology are given and the electrical performance of demonstrator circuits for mm-wave applications is presented.

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Publication Details

Published
2025-03-17
DOI
https://doi.org/10.23919/gemic64734.2025.10979048
Citations
1
Primary Topic
Advanced Wireless Communication Technologies
Type
article
Field-Weighted Citation Impact
0.73
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530GHz fmax 90nm SiGe BiCMOS Technology for Sensing and Communication Applications

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530GHz fmax 90nm SiGe BiCMOS Technology for Sensing and Communication Applications

Steffen Rothenhäußer, J. Böck, Vladislav Komenko, D. Tschumakow, A. Mukherjee, H.-D. Wohlmuth, Klaus Aufinger, M. Stavrev, H. Knapp
article en
1 citations

Abstract

This paper reports on Infineon's next generation SiGe BiCMOS technology B12HFC featuring a SiGe HBT with 530GHz maximum oscillation frequency integrated in a 90nm CMOS platform. Electrical high-frequency parameters are shown including uniformity within wafer and lot to lot variation. The features of the process design kit which enables circuit development are described. Results on reliability tests for the new technology are given and the electrical performance of demonstrator circuits for mm-wave applications is presented.

Infineon Technologies (Germany) (DE)
Openalex Percentile: Top 28%
Advanced Wireless Communication Technologies
0.73
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