Indium Bump Flip-Chip Process on Gold-Plated and Laser-Structured Alumina Substrate
A flip-chip bonding process of indium bump interconnects (IBI) is presented in this paper. Test structures manufactured using an InGaAs process are assembled onto laser-structured alumina carrier boards plated with a 2 μm thick gold layer. DC measurements and shear force tests are performed to evaluate the electrical and mechanical quality of the interconnects.
Authors
- Arnulf Leuther (ORCID: https://orcid.org/0000-0002-4369-591X)
- Thomas Zwick (ORCID: https://orcid.org/0000-0002-1268-0766)
- Katarzyna Holc
- Marius Kretschmann (ORCID: https://orcid.org/0000-0002-6497-8572)
Institutions
- Karlsruhe Institute of Technology (DE)
- Fraunhofer Institute for Applied Solid State Physics (DE)
Publication Details
- Published
- 2025-03-17
- DOI
- https://doi.org/10.23919/gemic64734.2025.10979093
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00