Investigations on the dissolution behavior of silicon in aqueous HF-HClO <sub>4</sub> -mixtures
Wet chemical etching processes are an essential part of silicon treatment in the photovoltaic and semiconductor industry. A commonly used system is HF-HNO<sub>3</sub>. In order to avoid NO <sub><i>x</i></sub> -formation, silicon can also be etched with HF-(HCl)-Cl<sub>2</sub>-mixtures. Thorough investigations into perchloric acid indicate that even Si-H terminated surfaces are inert against this very strong oxidizing agent.
Authors
- N. Schubert (ORCID: https://orcid.org/0009-0001-2661-8218)
- Edwin Kroke (ORCID: https://orcid.org/0000-0002-7934-6439)
- André Stapf (ORCID: https://orcid.org/0000-0003-3920-2809)
- Niklas Zomack (ORCID: https://orcid.org/0009-0002-2146-5491)
- Ann‐Lucia Neumann (ORCID: https://orcid.org/0009-0002-6462-6339)
Institutions
- TU Bergakademie Freiberg (DE)
Publication Details
- Journal
- RSC Advances
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ra00859j
- Citations
- 4
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 2.92
Funders
- Deutsche Forschungsgemeinschaft