Investigations on the dissolution behavior of silicon in aqueous HF-HClO <sub>4</sub> -mixtures

Wet chemical etching processes are an essential part of silicon treatment in the photovoltaic and semiconductor industry. A commonly used system is HF-HNO<sub>3</sub>. In order to avoid NO <sub><i>x</i></sub> -formation, silicon can also be etched with HF-(HCl)-Cl<sub>2</sub>-mixtures. Thorough investigations into perchloric acid indicate that even Si-H terminated surfaces are inert against this very strong oxidizing agent.

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Publication Details

Journal
RSC Advances
Published
2025-01-01
DOI
https://doi.org/10.1039/d5ra00859j
Citations
4
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
2.92

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article

Investigations on the dissolution behavior of silicon in aqueous HF-HClO 4 -mixtures

N. Schubert, Edwin Kroke, André Stapf, Niklas Zomack et al.
4 citations
RSC Advances
Semiconductor materials and devices
2.92
article

Investigations on the dissolution behavior of silicon in aqueous HF-HClO 4 -mixtures

N. Schubert, Edwin Kroke, André Stapf, Niklas Zomack, Ann‐Lucia Neumann
article en
4 citations

Abstract

Wet chemical etching processes are an essential part of silicon treatment in the photovoltaic and semiconductor industry. A commonly used system is HF-HNO<sub>3</sub>. In order to avoid NO <sub><i>x</i></sub> -formation, silicon can also be etched with HF-(HCl)-Cl<sub>2</sub>-mixtures. Thorough investigations into perchloric acid indicate that even Si-H terminated surfaces are inert against this very strong oxidizing agent.

RSC AdvancesVol. 15(20)
TU Bergakademie Freiberg (DE)
Deutsche Forschungsgemeinschaft
Clean water and sanitation
Openalex Percentile: Top 9%
Semiconductor materials and devices
2.92
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Investigations on the dissolution behavior of silicon in aqueous HF-HClO <sub>4</sub> -mixtures — N. Schubert, Edwin Kroke, et al. · RSC Advances (2025) | TGRS Research Map | TGRS