Fowler-Nordheim stress-induced degradation in n-channel MOSFETs

This study investigates the degradation mechanisms of gate oxide in n-channel MOSFETs subjected to Fowler-Nordheim constant current stress to introduce uniformly distributed defects. Different techniques were used to characterise the impact of stress-induced defects on the electrical properties of MOSFETs. The findings reveal distinct degradation behaviors, with early-stage negative shifts in threshold voltage attributed to hole trapping, transitioning to positive shifts due to interface state generation at higher electron fluence. The study also emphasises the factors that influence device performance. The results enhance our understanding of gate oxide reliability under high-field stress, as well as the mechanisms of defect creation and charge trapping in MOSFETs.

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Publication Details

Published
2025-04-08
DOI
https://doi.org/10.1109/reepe63962.2025.10971001
Citations
1
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
Type
article
Field-Weighted Citation Impact
0.73
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article

Fowler-Nordheim stress-induced degradation in n-channel MOSFETs

Igor V. Chukhraev, Vladimir E. Drach, Dmitry V. Mastykash
1 citations
Advancements in Semiconductor Devices and Circuit Design
0.73
article

Fowler-Nordheim stress-induced degradation in n-channel MOSFETs

Igor V. Chukhraev, Vladimir E. Drach, Dmitry V. Mastykash
article en
1 citations

Abstract

This study investigates the degradation mechanisms of gate oxide in n-channel MOSFETs subjected to Fowler-Nordheim constant current stress to introduce uniformly distributed defects. Different techniques were used to characterise the impact of stress-induced defects on the electrical properties of MOSFETs. The findings reveal distinct degradation behaviors, with early-stage negative shifts in threshold voltage attributed to hole trapping, transitioning to positive shifts due to interface state generation at higher electron fluence. The study also emphasises the factors that influence device performance. The results enhance our understanding of gate oxide reliability under high-field stress, as well as the mechanisms of defect creation and charge trapping in MOSFETs.

Bauman Moscow State Technical University (RU), Sochi State University (RU)
Openalex Percentile: Top 29%
Advancements in Semiconductor Devices and Circuit Design
0.73
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