Electronic-Photonic Integrated Circuits through Micro-Transfer Printing
We realized low-ohmic, high-speed interconnects to transfer-printed, 20 μm thick electronic chiplets with small (20 μm×20μm) pads. Spray-coated divinylsiloxane-bis-benzocyclobuten (DVS-BCB) ramps were created, onto which a lithographically defined metal redistribution layer including vias was fabricated. This approach facilitates short (low parasitic) interconnects between electronics and photonics.
Authors
- Biwei Pan (ORCID: https://orcid.org/0000-0002-9831-2808)
- Ruggero Loi (ORCID: https://orcid.org/0000-0002-9511-3344)
- Jing Zhang (ORCID: https://orcid.org/0000-0001-6608-9990)
- Günther Roelkens (ORCID: https://orcid.org/0000-0002-4667-5092)
- Prasanna Ramaswamy
- Tinus Pannier (ORCID: https://orcid.org/0000-0003-2225-0505)
- Patrick Steglich (ORCID: https://orcid.org/0000-0002-3689-5737)
- Peter Ossieur (ORCID: https://orcid.org/0000-0002-8737-9142)
- He Li (ORCID: https://orcid.org/0000-0002-6219-9911)
- Ye Gu (ORCID: https://orcid.org/0000-0002-4903-5170)
Institutions
- Ghent University (BE)
- Leibniz Institute for Neurobiology (DE)
Publication Details
- Published
- 2025-04-14
- DOI
- https://doi.org/10.1109/siphotonics64386.2025.10984590
- Citations
- 1
- Primary Topic
- Nanofabrication and Lithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.67