Aspect Ratio Trapping based Selective Ge growth under Ultra High Vacuum Chemical Vapor Deposition conditions

In this work, high-quality Ge film was selectively grown on a Si substrate using digermane under ultra-high vacuum chemical vapor deposition conditions. A low-defect-density film was achieved via aspect ratio trapping, with most dislocations confined within the silicon dioxide trenches.

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Published
2025-04-14
DOI
https://doi.org/10.1109/siphotonics64386.2025.10985067
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Aspect Ratio Trapping based Selective Ge growth under Ultra High Vacuum Chemical Vapor Deposition conditions

Chunlai Xue, Fenghe Fu, Chi Xu, Yue Li et al.
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Semiconductor materials and devices
article

Aspect Ratio Trapping based Selective Ge growth under Ultra High Vacuum Chemical Vapor Deposition conditions

Chunlai Xue, Fenghe Fu, Chi Xu, Yue Li, Guoyin Xu, Hui Cong, Zhengjie Wu
article en

Abstract

In this work, high-quality Ge film was selectively grown on a Si substrate using digermane under ultra-high vacuum chemical vapor deposition conditions. A low-defect-density film was achieved via aspect ratio trapping, with most dislocations confined within the silicon dioxide trenches.

Chinese Academy of Sciences (CN), Institute of Semiconductors (CN)
National Natural Science Foundation of China, Chinese Academy of Sciences
Openalex Percentile: Top 92%
Semiconductor materials and devices
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